COF (Chip On Flex, OR, Chip On Film), often referred to as coated Film, is the integrated circuit (IC) fixed On the flexible circuit board of the crystalline soft Film construction technology, the use of soft additional circuit board as packaging Chip carrier Chip and soft substrate circuit combination, or single refers to the unpackaged Chip of the soft additional circuit board, Including volume tape packaging production (TAB substrate, its process known as TCP), soft board connected chip components, soft IC board packaging. It has made great breakthroughs in product size, weight and high integration. Because flexible boards are thinner and lighter than sturdy PCBS, COF modules are smaller, lighter, and faster to design and produce.

"The ultra-narrow bezel, ultra-narrow chin of Huawei Mate series includes ClearView driver IC and ClearPad Touch IC. COF packaging is still a lot of industry, Vivo